PCR

PCR instruments require rapid and repeated temperature transitions to enable DNA denaturation,annealing,and extension.

This places extreme mechanical and thermal stress on TEC modules.

In conventional solder-based TEC structures,repeated heating and cooling cycles lead to:

1.Accumulation of therma stress inside the module

2.Fatigue and cracking at copper-ceramic interfaces

3.Degradation of electrical and thermal performance over time

4.Reduced lifetime and risk of premature module failure

The TCR series TEC adopts a flexible adhesive layer between the copper conductor

and ceramic substrate,specifically optimized for high-cycle thermal applications.Key performance improvements include:

1.Effective stress relief during rapid heating and cooling

2.Reduced mechanical strain on P-N dice and interconnects

3.Thermal cycling endurance exceeding 800,000 cycles

4.Stable performance under continuous PCR operation

5.Improved consistency across long test runs

1.Flexible adhesive layer→mitigates thermal stress accumulation

2.Solid-state,vibration-free design→ideal for sensitive biochemical assays

3.High reliability under fast ramp rates→supports rapid PCR protocols

4.Long operational lifetime→reduces maintenance and replacement cost

5.Compatibility with compact PCR architectures→enables instrument miniaturization

REPRESENTATIVE TEC MODELS FOR PCR SYSTEMS

The following models represent typicalTEC models commonly used in PCR systems applica-tions.They are provided for reference and comparison only,not as a complete product list.